Ultrathin silicon circuits with strain-isolation layers and mesh layouts for high-performance electronics on fabric, vinyl, leather, and paper

Dae Hyeong Kim; Yun Soung Kim; Jian Wu; Zhuangjian Liu; Jizhou Song; Hoon Sik Kim; Yonggang Y. Huang; Keh Chih Hwang; John A. Rogers

doi:10.1002/adma.200900405

Ultrathin silicon circuits with strain-isolation layers and mesh layouts for high-performance electronics on fabric, vinyl, leather, and paper

Dae Hyeong Kim, Yun Soung Kim, Jian Wu, Zhuangjian Liu, Jizhou Song, Hoon Sik Kim, Yonggang Y. Huang, Keh Chih Hwang, John A. Rogers

Mechanical & Aerospace Engineering

Research output: Contribution to journal › Article › peer-review

311 Scopus citations

Abstract

We present various stretchable highperformance CMOS circuit demonstrations on unconventional substrates, such as fabric, vinyl, leather, and paper. Electronics on such substrates, especially paper, open up new and important application possibilities for electronics. Theoretical analysis reveals the underlying mechanics of these systems; electrical tests under mechanical cycling demonstrate the robustness of the designs.

Original language	English (US)
Pages (from-to)	3703-3707
Number of pages	5
Journal	Advanced Materials
Volume	21
Issue number	36
DOIs	https://doi.org/10.1002/adma.200900405
State	Published - 2009

ASJC Scopus subject areas

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

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10.1002/adma.200900405

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Ultrathin silicon circuits with strain-isolation layers and mesh layouts for high-performance electronics on fabric, vinyl, leather, and paper. / Kim, Dae Hyeong; Kim, Yun Soung; Wu, Jian; Liu, Zhuangjian; Song, Jizhou; Kim, Hoon Sik; Huang, Yonggang Y.; Hwang, Keh Chih; Rogers, John A.

In: Advanced Materials, Vol. 21, No. 36, 2009, p. 3703-3707.

Research output: Contribution to journal › Article › peer-review

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