Numerical simulation of stretchable and foldable silicon integrated circuits

Zhuangjian Liu, Yongwei Zhang, Jizhou Song, Dae Hyeong Kim, Yonggang Huang, John Rogers

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ∼90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.

Original languageEnglish (US)
Title of host publicationNEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009
Pages197-200
Number of pages4
DOIs
StatePublished - Dec 1 2009
EventInternational Conference on Materials for Advanced Technologies, ICMAT 2009 - Singpore, Singapore
Duration: Jun 28 2009Jul 3 2009

Publication series

NameAdvanced Materials Research
Volume74
ISSN (Print)1022-6680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT 2009
CountrySingapore
CitySingpore
Period6/28/097/3/09

Keywords

  • Buckling
  • Finite element analysis
  • Flexible electronics
  • Stretchable electronics

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Liu, Z., Zhang, Y., Song, J., Kim, D. H., Huang, Y., & Rogers, J. (2009). Numerical simulation of stretchable and foldable silicon integrated circuits. In NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009 (pp. 197-200). (Advanced Materials Research; Vol. 74). https://doi.org/10.4028/www.scientific.net/AMR.74.197