TY - GEN
T1 - Modeling and simulation of a nanowire-based cantilever structure
AU - Bajpai, Ritu
AU - Tigli, Onur
AU - Zaghloul, Mona
PY - 2009/7/21
Y1 - 2009/7/21
N2 - Recently there has been a lot of research based on nanoscale structures and their applications but not a significant amount of modeling and simulation methods have been presented to expedite and simplifY such work. In this paper we have shown that the commercially available MEMS enabled software tools can be used to model nanoscale structures of the order of hundreds of nanometers and that this kind of modeling can also be used to simulate the application of such structures into devices like sensors.. ZnO nanowires have been modeled as a cantilever structure and their frequency response has been studied. The calculated and the simulated resonance frequencies for the nanowires varying in length from 600nm to 900nm had an average difference of 0.5%. Change in frequency response of the cantilever with addition of external mass was also found to be in accordance with the theoretical formula.
AB - Recently there has been a lot of research based on nanoscale structures and their applications but not a significant amount of modeling and simulation methods have been presented to expedite and simplifY such work. In this paper we have shown that the commercially available MEMS enabled software tools can be used to model nanoscale structures of the order of hundreds of nanometers and that this kind of modeling can also be used to simulate the application of such structures into devices like sensors.. ZnO nanowires have been modeled as a cantilever structure and their frequency response has been studied. The calculated and the simulated resonance frequencies for the nanowires varying in length from 600nm to 900nm had an average difference of 0.5%. Change in frequency response of the cantilever with addition of external mass was also found to be in accordance with the theoretical formula.
UR - http://www.scopus.com/inward/record.url?scp=67650527350&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=67650527350&partnerID=8YFLogxK
U2 - 10.1109/ESIME.2009.4938458
DO - 10.1109/ESIME.2009.4938458
M3 - Conference contribution
AN - SCOPUS:67650527350
SN - 9781424441617
T3 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
BT - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
T2 - 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009
Y2 - 26 April 2009 through 29 April 2009
ER -