Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations

Emrah Celik, Erkan Oterkus, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this study, the loading-unloading data obtained from the nono-indentation tests in combination with the peridynamic simulations are used to determine the elastic modulus and yield stress of the material. A simple search algorithm minimizing the difference between the predicted force- indentation depth and experiments leads to the determination of the material properties. Nano-indentation experiments are performed on both a soft polymer (polymethyldisiloxane (PDMS)) representative of the bulk dimensions, and a hard thin-film polymer (polystyrene (PS)) deposited on the bulk PDMS. Both the simulation and experimental results are validated by comparison against those previously published in the literature.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages262-268
Number of pages7
DOIs
StatePublished - 2009
Externally publishedYes
Event2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
Duration: May 26 2009May 29 2009

Other

Other2009 59th Electronic Components and Technology Conference, ECTC 2009
CountryUnited States
CitySan Diego, CA
Period5/26/095/29/09

Fingerprint

Ultrathin films
Nanoindentation
Indentation
Polymers
Polystyrenes
Unloading
Yield stress
Materials properties
Elastic moduli
Experiments
Thin films

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Celik, E., Oterkus, E., Guven, I., & Madenci, E. (2009). Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations. In Proceedings - Electronic Components and Technology Conference (pp. 262-268). [5074026] https://doi.org/10.1109/ECTC.2009.5074026

Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations. / Celik, Emrah; Oterkus, Erkan; Guven, Ibrahim; Madenci, Erdogan.

Proceedings - Electronic Components and Technology Conference. 2009. p. 262-268 5074026.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Celik, E, Oterkus, E, Guven, I & Madenci, E 2009, Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations. in Proceedings - Electronic Components and Technology Conference., 5074026, pp. 262-268, 2009 59th Electronic Components and Technology Conference, ECTC 2009, San Diego, CA, United States, 5/26/09. https://doi.org/10.1109/ECTC.2009.5074026
Celik E, Oterkus E, Guven I, Madenci E. Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations. In Proceedings - Electronic Components and Technology Conference. 2009. p. 262-268. 5074026 https://doi.org/10.1109/ECTC.2009.5074026
Celik, Emrah ; Oterkus, Erkan ; Guven, Ibrahim ; Madenci, Erdogan. / Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations. Proceedings - Electronic Components and Technology Conference. 2009. pp. 262-268
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