Ku-Band Frequency Selective 3D Vertical Pillar Array

Sabera Fahmida Shiba, Jun Ying Tan, Cheolbok Kim, Sung Jin Kim, Jungkwun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents frequency-selective 3D vertical pillars arrays that have been tuned to 15 GHz as a center frequency of the Ku-Band (12-18 GHz) for satellite applications. The vertical pillars were designed with a quarter wavelength height and a half lambda period at 15 GHz. Simple in-house fabrication methods including electroless and electro platings were introduced to fabricate the frequency-selective 3D vertical pillars arrays. An array of pillars was 3D printed together on the substrate. The electroless plating was introduced to deposit a seed copper layer over the device, where the pillar and the substrate were metalized simultaneously. An additional copper layer was electroplated over the sample to thicken the copper layer considering the skin depth at 15 GHz. The completed sample was electrically characterized using a network analyzer with two horn antennas operating at 15 GHz. Various 3D structures were successfully fabricated and showed great potentials for frequency selective surface applications.

Original languageEnglish (US)
Title of host publication21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1383-1386
Number of pages4
ISBN (Electronic)9781665412674
DOIs
StatePublished - Jun 20 2021
Event21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 - Virtual, Online, United States
Duration: Jun 20 2021Jun 25 2021

Publication series

Name21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021

Conference

Conference21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Country/TerritoryUnited States
CityVirtual, Online
Period6/20/216/25/21

Keywords

  • 3D structures
  • Electroless plating
  • Electroplating
  • Frequency selective device

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Control and Optimization
  • Instrumentation

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