Intraplane guided wave massive fanout optical interconnections

Ray T. Chen, Michael Renxun Wang, Tomasz Jannson

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

One-to-30 guided wave optical interconnections are demonstrated at 632.8 nm using a highly multiplexed waveguide volume hologram. This technology is capable of providing intrachip and intrawafer optical interconnections. The theoretical limit of the fanout number is addressed and experimentally confirmed. The measured data show that the diffracted beams have an average diffraction efficiency of 2.3% with ±0.2% variation. The demonstrated results can save surface space of electronic chips and also provide a large fanout capability due to the high index modulation of the volume hologram. Further applications based on this technology are very promising. Head-up display, high-speed optical data bus, surface enhanced Raman spectrometer, and optical sensors are some of the attractive ones.

Original languageEnglish
Pages (from-to)2071-2073
Number of pages3
JournalApplied Physics Letters
Volume57
Issue number20
DOIs
StatePublished - Dec 1 1990
Externally publishedYes

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head-up displays
chips (electronics)
optical measuring instruments
high speed
spectrometers
waveguides
modulation
diffraction

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Intraplane guided wave massive fanout optical interconnections. / Chen, Ray T.; Wang, Michael Renxun; Jannson, Tomasz.

In: Applied Physics Letters, Vol. 57, No. 20, 01.12.1990, p. 2071-2073.

Research output: Contribution to journalArticle

Chen, Ray T. ; Wang, Michael Renxun ; Jannson, Tomasz. / Intraplane guided wave massive fanout optical interconnections. In: Applied Physics Letters. 1990 ; Vol. 57, No. 20. pp. 2071-2073.
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