Hyperspectral image compression using three-dimensional wavelet coding

Xiaoli Tang, William A. Pearlman, James W. Modestino

Research output: Contribution to journalConference article

92 Scopus citations

Abstract

A Hyperspectral image is a sequence of images generated by collecting contiguously spaced spectral bands of data. One can view such an image sequence as a three-dimensional array of intensity values (pixels) within a rectangular prism. We present a Three-Dimensional Set Partitioned Embedded bloCK (3DSPECK) algorithm based on the observation that hyperspectral images are contiguous in the spectrum axis (this implies large interband correlations) and there is no motion between bands. Therefore, the three-dimensional discrete wavelet transform can fully exploit the inter-band correlations. A SPECK partitioning algorithm extended to three-dimensions is used to sort significant pixels. Rate distortion (Peak Signal-to-Noise Ratio (PSNR) vs. bit rate) performances were plotted by comparing 3DSPECK against 3DSPIHT on several sets of hyperspectral images. Results show that 3DSPECK is comparable to 3DSPIHT in hyperspectral image compression. 3DSPECK can achieve compression ratios in the approximate range of 16 to 27 while providing very high quality reconstructed images. It guarantees over 3 dB PSNR improvement at all rates or rate saving at least a factor of 2 over 2D coding of separate spectral bands without axial transformation.

Original languageEnglish (US)
Pages (from-to)1037-1047
Number of pages11
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5022 II
DOIs
StatePublished - Aug 22 2003
EventImage and Video Communications and Processing 2003 - Santa Clara, CA, United States
Duration: Jan 21 2003Jan 24 2003

Keywords

  • AVIRIS imaging
  • Discrete wavelet transform (DWT)
  • Hyperspectral imaging
  • SPIHT
  • Three dimensional image compression

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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