Experimental and numerical characterization of non-fickian moisture diffusion in electronic packages

Emrah Celik, Ibrahim Guven, Erdogan Madenci

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

This study investigates moisture diffusion characteristics of electronic packaging materials exhibiting Fickian and non-Fickian behaviors. The experimental investigation involves moisture absorption and desorption tests of homogenous underfill materials and inhomogeneous organic substrates representing Fickian and non-Fickian solids, respectively. In absorption tests, samples are dried out in an oven prior to testing in a humid environmental chamber. In desorption tests, samples are saturated in an environmental chamber under a specified temperature and relative humidity prior to the moisture desorption inside an oven. Samples in both tests are removed from the test environments and weighed frequently to obtain moisture weight change data. Using the test measurements of several different Fickian and non-Fickian materials, diffusivity/ moisture concentration relationships are constructed. These relationships are implemented into a customized finite element simulation tool under the ANSYS platform. This tool is validated by using the experimental measurements on multimaterial samples prepared from underfill and substrates.

Original languageEnglish (US)
Pages (from-to)666-674
Number of pages9
JournalIEEE Transactions on Advanced Packaging
Volume32
Issue number3
DOIs
StatePublished - 2009
Externally publishedYes

Fingerprint

Moisture
Environmental chambers
Desorption
Ovens
Electronics packaging
Packaging materials
Substrates
Atmospheric humidity
Testing
Temperature

Keywords

  • Measurement
  • Modeling
  • Moisture
  • Simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Experimental and numerical characterization of non-fickian moisture diffusion in electronic packages. / Celik, Emrah; Guven, Ibrahim; Madenci, Erdogan.

In: IEEE Transactions on Advanced Packaging, Vol. 32, No. 3, 2009, p. 666-674.

Research output: Contribution to journalArticle

@article{9cf34e56c6094d7fa2b9d7bc6174ca8d,
title = "Experimental and numerical characterization of non-fickian moisture diffusion in electronic packages",
abstract = "This study investigates moisture diffusion characteristics of electronic packaging materials exhibiting Fickian and non-Fickian behaviors. The experimental investigation involves moisture absorption and desorption tests of homogenous underfill materials and inhomogeneous organic substrates representing Fickian and non-Fickian solids, respectively. In absorption tests, samples are dried out in an oven prior to testing in a humid environmental chamber. In desorption tests, samples are saturated in an environmental chamber under a specified temperature and relative humidity prior to the moisture desorption inside an oven. Samples in both tests are removed from the test environments and weighed frequently to obtain moisture weight change data. Using the test measurements of several different Fickian and non-Fickian materials, diffusivity/ moisture concentration relationships are constructed. These relationships are implemented into a customized finite element simulation tool under the ANSYS platform. This tool is validated by using the experimental measurements on multimaterial samples prepared from underfill and substrates.",
keywords = "Measurement, Modeling, Moisture, Simulation",
author = "Emrah Celik and Ibrahim Guven and Erdogan Madenci",
year = "2009",
doi = "10.1109/TADVP.2009.2016848",
language = "English (US)",
volume = "32",
pages = "666--674",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "3",

}

TY - JOUR

T1 - Experimental and numerical characterization of non-fickian moisture diffusion in electronic packages

AU - Celik, Emrah

AU - Guven, Ibrahim

AU - Madenci, Erdogan

PY - 2009

Y1 - 2009

N2 - This study investigates moisture diffusion characteristics of electronic packaging materials exhibiting Fickian and non-Fickian behaviors. The experimental investigation involves moisture absorption and desorption tests of homogenous underfill materials and inhomogeneous organic substrates representing Fickian and non-Fickian solids, respectively. In absorption tests, samples are dried out in an oven prior to testing in a humid environmental chamber. In desorption tests, samples are saturated in an environmental chamber under a specified temperature and relative humidity prior to the moisture desorption inside an oven. Samples in both tests are removed from the test environments and weighed frequently to obtain moisture weight change data. Using the test measurements of several different Fickian and non-Fickian materials, diffusivity/ moisture concentration relationships are constructed. These relationships are implemented into a customized finite element simulation tool under the ANSYS platform. This tool is validated by using the experimental measurements on multimaterial samples prepared from underfill and substrates.

AB - This study investigates moisture diffusion characteristics of electronic packaging materials exhibiting Fickian and non-Fickian behaviors. The experimental investigation involves moisture absorption and desorption tests of homogenous underfill materials and inhomogeneous organic substrates representing Fickian and non-Fickian solids, respectively. In absorption tests, samples are dried out in an oven prior to testing in a humid environmental chamber. In desorption tests, samples are saturated in an environmental chamber under a specified temperature and relative humidity prior to the moisture desorption inside an oven. Samples in both tests are removed from the test environments and weighed frequently to obtain moisture weight change data. Using the test measurements of several different Fickian and non-Fickian materials, diffusivity/ moisture concentration relationships are constructed. These relationships are implemented into a customized finite element simulation tool under the ANSYS platform. This tool is validated by using the experimental measurements on multimaterial samples prepared from underfill and substrates.

KW - Measurement

KW - Modeling

KW - Moisture

KW - Simulation

UR - http://www.scopus.com/inward/record.url?scp=68949181711&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=68949181711&partnerID=8YFLogxK

U2 - 10.1109/TADVP.2009.2016848

DO - 10.1109/TADVP.2009.2016848

M3 - Article

VL - 32

SP - 666

EP - 674

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

SN - 1521-3323

IS - 3

ER -