Design optimization of micro-channel heat exchanger embedded in LTCC

Aparna Aravelli, Singiresu S Rao, Hari K. Adluru

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Increase in the density of electronic packaging leads to the investigation of highly efficient thermal management systems. The challenge in these micro-systems is to maximize heat transfer per unit volume. In the author's previous work, experimental and computational analysis has been performed on LTCC substrates using embedded silver vias. This novel technique of embedding silver vias along with forced convection resulted in higher heat transfer rates. The present work further investigates into the optimization of this model. A Multi-objective optimization problem has been formulated for the heat transfer in the LTCC model. The Log Mean Temperature Difference (LMTD) method of heat exchangers has been used in the formulation. Optimization is done based on maximization of the total heat transferred and minimization of the coolant pumping power. Structural and thermal design variables are considered to meet the manufacturability and energy requirements. Demanded pressure loss and volume of the silver metal are used as constraints. The classical optimization technique Sequential Quadratic Programming (SQP) is used to solve the micro-heat exchanger problem. The optimal design is presented and sensitivity analysis results are discussed.

Original languageEnglish
Title of host publicationProceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012
Pages857-865
Number of pages9
StatePublished - Dec 1 2012
Event45th Annual International Symposium on Microelectronics, IMAPS 2012 - San Diego, CA, United States
Duration: Sep 9 2012Sep 13 2012

Other

Other45th Annual International Symposium on Microelectronics, IMAPS 2012
CountryUnited States
CitySan Diego, CA
Period9/9/129/13/12

Fingerprint

Heat exchangers
Silver
Heat transfer
Electronics packaging
Quadratic programming
Forced convection
Multiobjective optimization
Temperature control
Coolants
Sensitivity analysis
Enthalpy
Design optimization
Substrates
Metals
Temperature

Keywords

  • Electronic cooling
  • LTCC
  • Micro heat exchanger
  • Micro-channel
  • Optimization

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Aravelli, A., Rao, S. S., & Adluru, H. K. (2012). Design optimization of micro-channel heat exchanger embedded in LTCC. In Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012 (pp. 857-865)

Design optimization of micro-channel heat exchanger embedded in LTCC. / Aravelli, Aparna; Rao, Singiresu S; Adluru, Hari K.

Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012. 2012. p. 857-865.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Aravelli, A, Rao, SS & Adluru, HK 2012, Design optimization of micro-channel heat exchanger embedded in LTCC. in Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012. pp. 857-865, 45th Annual International Symposium on Microelectronics, IMAPS 2012, San Diego, CA, United States, 9/9/12.
Aravelli A, Rao SS, Adluru HK. Design optimization of micro-channel heat exchanger embedded in LTCC. In Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012. 2012. p. 857-865
Aravelli, Aparna ; Rao, Singiresu S ; Adluru, Hari K. / Design optimization of micro-channel heat exchanger embedded in LTCC. Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012. 2012. pp. 857-865
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