Compact 3D wafer packaging using waveguide holographic optical elements

Cong Nguyen, Freddie Lin, Michael Wang

Research output: Contribution to journalConference article

Abstract

A waveguide holographic optical interconnect technique is used for signal distribution operations in a compact 3D wafer packaging configuration. This paper describes the design, fabrication and results of an integrated optical device which utilizes this waveguide holographic optical interconnect technique.

Original languageEnglish (US)
Pages (from-to)284-289
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume1773
DOIs
StatePublished - Feb 2 1993
Externally publishedYes
EventPhotonics for Computers, Neural Networks, and Memories 1992 - San Diego, United States
Duration: Jul 22 1992 → …

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Compact 3D wafer packaging using waveguide holographic optical elements'. Together they form a unique fingerprint.

  • Cite this