An improved low diffusion E-CUSP upwind scheme

Ge Cheng Zha, Yiqing Shen, Baoyuan Wang

Research output: Contribution to journalArticle

86 Scopus citations


An improved low diffusion E-CUSP (LDE) scheme is presented. The E-CUSP scheme can capture crisp shock profile and exact contact surface. Several numerical cases are presented to demonstrate the accuracy and robustness of the new scheme.

Original languageEnglish (US)
Pages (from-to)214-220
Number of pages7
JournalComputers and Fluids
Issue number1
StatePublished - Sep 1 2011


  • Low diffusion
  • Riemann solver

ASJC Scopus subject areas

  • Computer Science(all)
  • Engineering(all)

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