An improved low diffusion E-CUSP upwind scheme

GeCheng Zha, Yiqing Shen, Baoyuan Wang

Research output: Contribution to journalArticle

82 Citations (Scopus)

Abstract

An improved low diffusion E-CUSP (LDE) scheme is presented. The E-CUSP scheme can capture crisp shock profile and exact contact surface. Several numerical cases are presented to demonstrate the accuracy and robustness of the new scheme.

Original languageEnglish
Pages (from-to)214-220
Number of pages7
JournalComputers and Fluids
Volume48
Issue number1
DOIs
StatePublished - Sep 1 2011

Keywords

  • Low diffusion
  • Riemann solver

ASJC Scopus subject areas

  • Computer Science(all)
  • Engineering(all)

Cite this

An improved low diffusion E-CUSP upwind scheme. / Zha, GeCheng; Shen, Yiqing; Wang, Baoyuan.

In: Computers and Fluids, Vol. 48, No. 1, 01.09.2011, p. 214-220.

Research output: Contribution to journalArticle

Zha, GeCheng ; Shen, Yiqing ; Wang, Baoyuan. / An improved low diffusion E-CUSP upwind scheme. In: Computers and Fluids. 2011 ; Vol. 48, No. 1. pp. 214-220.
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