An improved low diffusion E-CUSP upwind scheme

GeCheng Zha, Yiqing Shen, Baoyuan Wang

Research output: Contribution to journalArticle

86 Scopus citations


An improved low diffusion E-CUSP (LDE) scheme is presented. The E-CUSP scheme can capture crisp shock profile and exact contact surface. Several numerical cases are presented to demonstrate the accuracy and robustness of the new scheme.

Original languageEnglish
Pages (from-to)214-220
Number of pages7
JournalComputers and Fluids
Issue number1
StatePublished - Sep 1 2011


  • Low diffusion
  • Riemann solver

ASJC Scopus subject areas

  • Computer Science(all)
  • Engineering(all)

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