A Novel Saw Device in CMOS: Design, Modeling, and Fabrication

The design, finite element modeling, fabrication, and characterization of a novel surface acoustic wave (SAW) delay line for bio/chemical and telecommunication applications in CMOS technology are introduced. A full modeling was carried out. The devices are designed in a standard semiconductor foundry 1.5-μm two-metal two-poly process. A unique maskless postprocessing sequence is designed and completed. The three postprocessing steps are fully compatible with any standard integrated circuit technology such as CMOS. This allows any signal control/processing circuitry to be easily integrated on the same chip. ZnO is used as the piezoelectric material for SAW generation. A thorough characterization and patterning optimization of the sputtered ZnO was carried out. The major novelties that are introduced in the SAW delay line features are the embedded heater elements for temperature control, compensation, and acoustic absorbers that are designed to eliminate edge reflections and minimize triple transit interference that is amplified by edge reflections. Both of these attributes are designed by using CMOS materials without disturbing SAW performance.