Abstract
A cohesive zone model is proposed in this paper in an effort to predict the low cycle fatigue life of solder joints plastically deformed under cyclic loading. Damage mechanics is incorporated into the cohesive law to account for the gradual loss of stiffness and strength of solder materials under cyclic loading. The damage evolution law is assumed to be a function of accumulated plastic strain. It has been demonstrated that, once the parameters of the cohesive zone model are determined via one particular cyclic test, it is then able to predict the fatigue life of solder joints made of the same materials system under different loading conditions.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 85-95 |
| Number of pages | 11 |
| Journal | Microelectronic Engineering |
| Volume | 75 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jul 1 2004 |
| Externally published | Yes |
| Event | Proceedings of the Symposium on Characterization - Phoenix, AZ, United States Duration: Jun 17 2003 → Jun 20 2003 |
Keywords
- Cohesive zone model
- Damage mechanics
- Fatigue life
- Fracture
- Solder joints
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films
- Atomic and Molecular Physics, and Optics
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Cite this
Yang, Q. D., Shim, D. J., & Spearing, S. M. (2004). A cohesive zone model for low cycle fatigue life prediction of solder joints. Microelectronic Engineering, 75(1), 85-95. https://doi.org/10.1016/j.mee.2003.11.009