A cohesive zone model for low cycle fatigue life prediction of solder joints

Qingda Yang, D. J. Shim, S. M. Spearing

Research output: Contribution to journalArticle

66 Citations (Scopus)

Abstract

A cohesive zone model is proposed in this paper in an effort to predict the low cycle fatigue life of solder joints plastically deformed under cyclic loading. Damage mechanics is incorporated into the cohesive law to account for the gradual loss of stiffness and strength of solder materials under cyclic loading. The damage evolution law is assumed to be a function of accumulated plastic strain. It has been demonstrated that, once the parameters of the cohesive zone model are determined via one particular cyclic test, it is then able to predict the fatigue life of solder joints made of the same materials system under different loading conditions.

Original languageEnglish
Pages (from-to)85-95
Number of pages11
JournalMicroelectronic Engineering
Volume75
Issue number1
DOIs
StatePublished - Jul 1 2004
Externally publishedYes

Fingerprint

fatigue life
solders
Soldering alloys
Fatigue of materials
cycles
predictions
damage
Plastic deformation
stiffness
Mechanics
plastics
Stiffness

Keywords

  • Cohesive zone model
  • Damage mechanics
  • Fatigue life
  • Fracture
  • Solder joints

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics

Cite this

A cohesive zone model for low cycle fatigue life prediction of solder joints. / Yang, Qingda; Shim, D. J.; Spearing, S. M.

In: Microelectronic Engineering, Vol. 75, No. 1, 01.07.2004, p. 85-95.

Research output: Contribution to journalArticle

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