A cohesive zone model for low cycle fatigue life prediction of solder joints

Q. D. Yang; D. J. Shim; S. M. Spearing

doi:10.1016/j.mee.2003.11.009

A cohesive zone model for low cycle fatigue life prediction of solder joints

Q. D. Yang, D. J. Shim, S. M. Spearing

Research output: Contribution to journal › Conference article › peer-review

70 Scopus citations

Abstract

A cohesive zone model is proposed in this paper in an effort to predict the low cycle fatigue life of solder joints plastically deformed under cyclic loading. Damage mechanics is incorporated into the cohesive law to account for the gradual loss of stiffness and strength of solder materials under cyclic loading. The damage evolution law is assumed to be a function of accumulated plastic strain. It has been demonstrated that, once the parameters of the cohesive zone model are determined via one particular cyclic test, it is then able to predict the fatigue life of solder joints made of the same materials system under different loading conditions.

Original language	English (US)
Pages (from-to)	85-95
Number of pages	11
Journal	Microelectronic Engineering
Volume	75
Issue number	1
DOIs	https://doi.org/10.1016/j.mee.2003.11.009
State	Published - Jul 2004
Externally published	Yes
Event	Proceedings of the Symposium on Characterization - Phoenix, AZ, United States Duration: Jun 17 2003 → Jun 20 2003

Keywords

Cohesive zone model
Damage mechanics
Fatigue life
Fracture
Solder joints

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Atomic and Molecular Physics, and Optics

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10.1016/j.mee.2003.11.009

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title = "A cohesive zone model for low cycle fatigue life prediction of solder joints",

abstract = "A cohesive zone model is proposed in this paper in an effort to predict the low cycle fatigue life of solder joints plastically deformed under cyclic loading. Damage mechanics is incorporated into the cohesive law to account for the gradual loss of stiffness and strength of solder materials under cyclic loading. The damage evolution law is assumed to be a function of accumulated plastic strain. It has been demonstrated that, once the parameters of the cohesive zone model are determined via one particular cyclic test, it is then able to predict the fatigue life of solder joints made of the same materials system under different loading conditions.",

keywords = "Cohesive zone model, Damage mechanics, Fatigue life, Fracture, Solder joints",

author = "Yang, {Q. D.} and Shim, {D. J.} and Spearing, {S. M.}",

note = "Funding Information: The authors are very grateful to the support from AFOSR through Grant No. 49620-02-1-006 with Dr. B.L. Lee. The authors would like to extend special thanks to Dr. Brian N. Cox at RSC for valuable discussions during the course of the work. ; Proceedings of the Symposium on Characterization ; Conference date: 17-06-2003 Through 20-06-2003",

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AU - Shim, D. J.

AU - Spearing, S. M.

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AB - A cohesive zone model is proposed in this paper in an effort to predict the low cycle fatigue life of solder joints plastically deformed under cyclic loading. Damage mechanics is incorporated into the cohesive law to account for the gradual loss of stiffness and strength of solder materials under cyclic loading. The damage evolution law is assumed to be a function of accumulated plastic strain. It has been demonstrated that, once the parameters of the cohesive zone model are determined via one particular cyclic test, it is then able to predict the fatigue life of solder joints made of the same materials system under different loading conditions.

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